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IRFBC20S Datasheet, PDF (2/10 Pages) International Rectifier – Power MOSFET(Vdss=600V, Rds(on)=4.4ohm, Id=2.2A) | |||
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IRFBC20S/L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
âV(BR)DSS/âTJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
600 âââ âââ V VGS = 0V, ID = 250µA
âââ 0.88 âââ V/°C Reference to 25°C, ID =1mAÂ
âââ âââ 4.4 ⦠VGS =10V, ID = 1.3A Â
2.0 âââ 4.0 V VDS = VGS, ID = 250µA
1.4 âââ âââ S VDS = 50V, ID = 1.3AÂ
âââ âââ 100 µA VDS = 600V, VGS = 0V
âââ âââ 500
VDS = 480V, VGS = 0V, TJ = 125°C
âââ âââ 100 nA VGS = 20V
âââ âââ -100
VGS = -20V
âââ âââ 18
ID = 2.0A
âââ âââ 3.0
âââ âââ 8.9
nC VDS = 360V
VGS = 10V, See Fig. 6 and 13 ÂÂ
âââ 10 âââ
VDD = 300V
âââ 23 âââ ns ID = 2.0A
âââ 30 âââ
RG = 18â¦
âââ 25 âââ
RD = 150â¦, See Fig. 10 ÂÂ
Between lead,
âââ 7.5 âââ nH and center of die contact
âââ 350 âââ
VGS = 0V
âââ 48 âââ pF VDS = 25V
âââ 8.6 âââ
Æ = 1.0MHz, See Fig. 5Â
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) Â
V SD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
âââ âââ 2.2 A showing the
integral reverse
G
âââ âââ 8.0
p-n junction diode.
S
âââ âââ 1.6 V TJ = 25°C, IS = 2.2A, VGS = 0V Â
âââ 290 580 ns TJ = 25°C, IF = 2.0A
âââ 0.67 1.3 µC di/dt = 100A/µs ÂÂ
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
 VDD =50V, starting TJ = 25°C, L =31mH
RG = 25â¦, IAS = 2.2A. (See Figure 12)
 ISD ⤠2.2A, di/dt ⤠40A/µs, VDD ⤠V(BR)DSS,
TJ ⤠150°C
 Pulse width ⤠300µs; duty cycle ⤠2%.
Â
Uses IRFBC20 data and test conditions
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
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