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IRF9Z24NSTRR Datasheet, PDF (2/11 Pages) International Rectifier – Advanced Process Technology
IRF9Z24NS/L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)DSS
∆V(BR)DSS/∆TJ
RDS(on)
VGS(th)
gfs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
-55 ––– ––– V
––– -0.05 ––– V/°C
––– ––– 0.175 Ω
-2.0 ––– -4.0 V
2.5 ––– ––– S
––– ––– -25 µA
––– ––– -250
––– ––– 100
nA
––– ––– -100
––– ––– 19
––– ––– 5.1 nC
––– ––– 10
––– 13 –––
––– 55 –––
ns
––– 23 –––
––– 37 –––
7.5
nH
––– 350 –––
––– 170 ––– pF
––– 92 –––
Conditions
VGS = 0V, ID = -250µA
Reference to 25°C, ID = -1mA…
VGS = -10V, ID = -7.2A „
VDS = VGS, ID = -250µA
VDS = -25V, ID = -7.2A
VDS = -55V, VGS = 0V
VDS = -44V, VGS = 0V, TJ = 150°C
VGS = 20V
VGS = -20V
ID = -7.2A
VDS = -44V
VGS = -10V, See Fig. 6 and 13 „…
VDD = -28V
ID = -7.2A
RG = 24Ω
RD = 3.7Ω, See Fig. 10 „…
Between lead,
and center of die contact
VGS = 0V
VDS = -25V
ƒ = 1.0MHz, See Fig. 5…
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) •
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
––– ––– -12
––– ––– -48
––– ––– -1.6
MOSFET symbol
D
A showing the
integral reverse
G
p-n junction diode.
S
V TJ = 25°C, IS = -7.2A, VGS = 0V „
––– 47 71 ns TJ = 25°C, IF = -7.2A
––– 84 130 nC di/dt = -100A/µs „…
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
„ Pulse width ≤ 300µs; duty cycle ≤ 2%.
‚ Starting TJ = 25°C, L = 3.7mH
… Uses IRF9Z24N data and test conditions
RG = 25Ω, IAS = -7.2A. (See Figure 12)
ƒ ISD ≤ -7.2A, di/dt ≤ -280A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
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