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IRF9540NSTRRPBF Datasheet, PDF (2/11 Pages) International Rectifier – Advanced Process Technology | |||
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IRF9540NS/L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
âV(BR)DSS/âTJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
-100   V VGS = 0V, ID = -250µA
 -0.11  V/°C Reference to 25°C, ID = -1mAÂ
  0.117 ⦠VGS = -10V, ID = -11A Â
-2.0  -4.0 V VDS = VGS, ID = -250µA
5.3 ÂÂÂ ÂÂÂ S VDS = -50V, ID = -11AÂ
  -25 µA VDS = -100V, VGS = 0V
ÂÂÂ ÂÂÂ -250
VDS = -80V, VGS = 0V, TJ = 150°C
ÂÂÂ ÂÂÂ 100 n A VGS = 20V
ÂÂÂ ÂÂÂ -100
VGS = -20V
ÂÂÂ ÂÂÂ 97
ID = -11A
ÂÂÂ ÂÂÂ 15 nC VDS = -80V
ÂÂÂ ÂÂÂ 51
VGS = -10V, See Fig. 6 and 13 ÂÂ
ÂÂÂ 15 ÂÂÂ
VDD = -50V
ÂÂÂ 67 ÂÂÂ ns ID = -11A
ÂÂÂ 51 ÂÂÂ
RG = 5.1â¦
ÂÂÂ 51 ÂÂÂ
RD = 4.2â¦, See Fig. 10 Â
ÂÂÂ
7.5 ÂÂÂ
nH
Between lead,
and center of die contact
ÂÂÂ 1300 ÂÂÂ
VGS = 0V
ÂÂÂ 400 ÂÂÂ pF VDS = -25V
ÂÂÂ 240 ÂÂÂ
 = 1.0MHz, See Fig. 5Â
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
I SM
Pulsed Source Current
(Body Diode) Â
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
ÂÂÂ ÂÂÂ -23
A
showing the
integral reverse
G
ÂÂÂ ÂÂÂ -76
p-n junction diode.
S
  -1.6 V TJ = 25°C, IS = -11A, VGS = 0V Â
 150 220 ns TJ = 25°C, IF = -11A
 830 1200 nC di/dt = -100A/µs ÂÂ
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
 Pulse width ⤠300µs; duty cycle ⤠2%.
 Starting TJ = 25°C, L = 7.1mH
RG = 25â¦, IAS = -11A. (See Figure 12)
Â
Uses IRF9540N data and test conditions
 ISD ⤠-11A, di/dt ⤠-470A/µs, VDD ⤠V(BR)DSS,
TJ ⤠175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
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