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IRF840LCS Datasheet, PDF (2/10 Pages) International Rectifier – Power MOSFET(Vdss=500V, Rds(on)=0.85ohm, Id=8.0A) | |||
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IRF840LCS/LCL
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
âV(BR)DSS/âTJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
500 âââ âââ V
âââ 0.63 âââ V/°C
âââ âââ 0.85 â¦
2.0 âââ 4.0 V
4.0 âââ âââ S
âââ âââ 25 µA
âââ âââ 250
âââ âââ 100
nA
âââ âââ -100
âââ âââ 39
âââ âââ 10 nC
âââ âââ 19
âââ 12 âââ
âââ 25 âââ
ns
âââ 27 âââ
âââ 19 âââ
âââ 7.5 âââ nH
âââ 1100 âââ
âââ 170 âââ pF
âââ 18 âââ
Conditions
VGS = 0V, ID = 250µA
Reference to 25°C, ID = 1mAÂ
VGS = 10V, ID = 4.8A Â
VDS = VGS, ID = 250µA
VDS = 50V, ID = 4.8AÂ
VDS = 500V, VGS = 0V
VDS = 400V, VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
ID = 8.0A
VDS = 400V
VGS = 10V, See Fig. 6 and 13 ÂÂ
VDD = 250V
ID = 8.0A
RG = 9.1â¦
RD = 30â¦, See Fig. 10 ÂÂ
Between lead,
and center of die contact
VGS = 0V
VDS = 25V
Æ = 1.0MHz, See Fig. 5Â
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) ÂÂ
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
âââ âââ 8.0
A showing the
integral reverse
G
âââ âââ 28
p-n junction diode.
S
âââ âââ 2.0 V TJ = 25°C, IS = 8.0A, VGS = 0V Â
âââ 490 740 ns TJ = 25°C, IF = 8.0A
âââ 3.0 4.5 µC di/dt = 100A/µs ÂÂ
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11)
 Pulse width ⤠300µs; duty cycle ⤠2%.
 Starting TJ = 25°C, L = 14mH
RG = 25â¦, IAS = 8.0A. (See Figure 12)
 ISD ⤠8.0A, di/dt ⤠100A/µs, VDD ⤠V(BR)DSS,
TJ ⤠150°C
Â
Uses IRF840LC data and test conditions
** When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended soldering techniques refer to application note #AN-994.
2
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