IRF7946PBF Datasheet, PDF (2/12 Pages) International Rectifier – DirectFETPower MOSFET

IRF7946PbF
Absolute Maximum Ratings
Symbol
Parameter
I_D @ T_C = 25°C
I_D @ T_C = 100°C
I_D @ T_C = 25°C
I_DM
Continuous Drain Current, V_GS @ 10V (Silicon Limited)
Continuous Drain Current, V_GS @ 10V (Silicon Limited)
d ^{Continuous Drain Current, VGS @ 10V (Package Limited)}
Pulsed Drain Current
P_D @T_C = 25°C
Maximum Power Dissipation
Linear Derating Factor
V_GS
Gate-to-Source Voltage
T_J
Operating Junction and
T_STG
Storage Temperature Range
Avalanche Characteristics
E_{AS (Thermally limited)}
E_{AS (tested)}
I_AR
E_AR
e Single Pulse Avalanche Energy
l Single Pulse Avalanche Energy Tested Value
Ãd Avalanche Current
d Repetitive Avalanche Energy
Thermal Resistance
Symbol
R_JA
R_JA
R_JA
R_JC
R_JA-PCB
Parameter
n Junction-to-Ambient
p Junction-to-Ambient
o Junction-to-Ambient
qk Junction-to-Case
Junction-to-PCB Mounted
Static @ T_J = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ.
V_(BR)DSS
V_(BR)DSS/T_J
R_DS(on)
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
40 –––
––– 0.03
––– 1.1
1.7
V_GS(th)
I_DSS
Gate Threshold Voltage
Drain-to-Source Leakage Current
2.2 3.0
––– –––
––– –––
I_GSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
––– –––
––– –––
R_G
Internal Gate Resistance
––– 0.67
Max.
198™
125™
90
793
96
0.77
± 20
-55 to + 150
Units
A
W
W/°C
V
°C
85
163
See Fig. 14, 15, 22a, 22b
Typ.
–––
12.5
20
–––
1.0
Max.
55
–––
–––
1.3
–––
mJ
A
mJ
Units
°C/W
Max.
–––
–––
1.4
–––
3.9
1.0
150
100
-100
–––
Units
Conditions
V
V/°C
m
m
V
μA
nA

V_GS = 0V, I_D = 250μA
d Reference to 25°C, I_D = 1.0mA
g V_GS = 10V, I_D = 90A
g V_GS = 6.0V, I_D = 72A
V_DS = V_GS, I_D = 150μA
V_DS = 40V, V_GS = 0V
V_DS = 40V, V_GS = 0V, T_J = 125°C
V_GS = 20V
V_GS = -20V
Notes:
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Ž Used double sided cooling , mounting pad with large heatsink.
 T_C measured with thermocouple mounted to top (Drain) of part.
ΠSurface mounted on 1 in. square Cu
(still air).
2
 Mounted to a PCB with
small clip heatsink (still air)
 Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
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