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IRF7480MTRPBF Datasheet, PDF (2/12 Pages) International Rectifier – Synchronous rectifier applications | |||
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IRF7480MTRPbF
Absolute Maximum Ratings
Symbol
Parameter
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 100°C
IDM
PD @TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Pulsed Drain Current ïï
Maximum Power Dissipation
Linear Derating Factor
VGS
TJ
TSTG
Gate-to-Source Voltage
Operating Junction and
Storage Temperature Range
Avalanche Characteristics
EAS (Thermally limited) Single Pulse Avalanche Energy ïï
EAS (Thermally limited) Single Pulse Avalanche Energy ïï
IAR
Avalanche Current ïï
EAR
Repetitive Avalanche Energy ïï
Thermal Resistance
Symbol
Parameter
Rï±JA
Rï±JA
Rï±JA
Rï±JC
Rï±J-PCB
Junction-to-Ambient ïï
Junction-to-Ambient ïï
Junction-to-Ambient ïï
Junction-to-Case ïïï
Junction-to-PCB Mounted
Max.
217ï
137ï
868
96
0.77
± 20
-55 to + 150
Units
A
W
W/°C
V
°C
81
206
mJ
See Fig.15,16, 23a, 23b
A
mJ
Typ.
âââ
12.5
20
âââ
0.75
Max.
45
âââ
âââ
1.3
âââ
Units
°C/W
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
V(BR)DSS
Drain-to-Source Breakdown Voltage
ïV(BR)DSS/ïTJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
RG
Internal Gate Resistance
Notes:
ï Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
ï Used double sided cooling , mounting pad with large heatsink.
Min.
40
âââ
âââ
âââ
2.1
âââ
âââ
âââ
âââ
âââ
Typ.
âââ
30
0.95
1.60
3.0
âââ
âââ
âââ
âââ
0.81
Max. Units
Conditions
âââ V VGS = 0V, ID = 250µA
âââ mV/°C Reference to 25°C, ID = 1.0mAï
1.20
âââ
mïï
VGS = 10V, ID = 132A ï
VGS = 6.0V, ID = 66A ï
3.9
V VDS = VGS, ID = 150µA
1.0
150
µA
VDS = 40V, VGS = 0V
VDS = 40V, VGS = 0V, TJ = 125°C
100
-100
nA
VGS = 20V
VGS = -20V
âââ ï
ï TC measured with thermocouple mounted to top (Drain) of part.
ï Surface mounted on 1 in. square Cu
board (still air).
ï Mounted to a PCB with small clip
heatsink (still air)
ï Mounted on minimum footprint full size
board with metalized back and with
small clip heatsink (still air)
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May 14, 2015
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