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IRF7404 Datasheet, PDF (2/8 Pages) International Rectifier – HEXFET Power MOSFET
IRF7404
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(ON)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
-20 ––– –––
––– -0.012 –––
––– ––– 0.040
––– ––– 0.060
V
V/°C
Ω
VGS = 0V, ID = -250µA
Reference to 25°C, ID = -1mA
VGS = -4.5V, ID = -3.2A ƒ
VGS = -2.7V, ID = -2.7A ƒ
-0.70 ––– ––– V VDS = VGS, ID = -250µA
6.8 ––– ––– S VDS = -15V, ID = -3.2A
––– ––– -1.0 µA VDS = -16V, VGS = 0V
––– ––– -25
VDS = -16V, VGS = 0V, TJ = 125°C
––– ––– -100 nA VGS = -12V
––– ––– 100
VGS = 12V
––– ––– 50
ID = -3.2A
––– ––– 5.5 nC VDS = -16V
––– ––– 21
VGS = -4.5V, See Fig. 6 and 12 ƒ
––– 14 –––
VDD = -10V
––– 32 ––– ns ID = -3.2A
––– 100 –––
RG = 6.0Ω
––– 65 –––
RD = 3.1Ω, See Fig. 10 ƒ
D
––– 2.5 –––
nH Between lead tip
and center of die contact G
––– 4.0 –––
S
––– 1500 –––
VGS = 0V
––– 730 ––– pF VDS = -15V
––– 340 –––
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) 
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
––– ––– -3.1
––– ––– -27
––– ––– -1.0
––– 69 100
––– 71 110
MOSFET symbol
D
showing the
A
integral reverse
G
p-n junction diode.
S
V TJ = 25°C, IS = -2.0A, VGS = 0V ƒ
ns TJ = 25°C, IF = -3.2A
µC di/dt = 100A/µs ƒ
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
ƒ Pulse width ≤ 300µs; duty cycle ≤ 2%.
‚ ISD ≤ -3.2A, di/dt ≤ -65A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
2
„ Surface mounted on FR-4 board, t ≤ 10sec.
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