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AUIRFS4010-7P Datasheet, PDF (2/12 Pages) International Rectifier – HEXFETPower MOSFET | |||
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AUIRFS4010-7P
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
ÎV(BR)DSS/ÎTJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
100
âââ
âââ
âââ
0.11
3.3
âââ
âââ
4.0
V VGS = 0V, ID = 250μA
 V/°C Reference to 25°C, ID = 5mA
f mΩ VGS = 10V, ID = 110A
VGS(th)
Gate Threshold Voltage
2.0 âââ 4.0 V VDS = VGS, ID = 250μA
gfs
Forward Transconductance
210 âââ âââ S VDS = 25V, ID = 110A
RG
Internal Gate Resistance
IDSS
Drain-to-Source Leakage Current
âââ 2.1 âââ
âââ âââ 20
âââ âââ 250
Ω
μA
VDS = 100V, VGS = 0V
VDS = 100V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
âââ
âââ
âââ 100
âââ -100
nA
VGS = 20V
VGS = -20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
Qg
Total Gate Charge
âââ 150 230
Qgs
Gate-to-Source Charge
âââ 36 âââ
Qgd
Gate-to-Drain ("Miller") Charge
âââ 48 âââ
Qsync
Total Gate Charge Sync. (Qg - Qgd)
âââ 102 âââ
td(on)
Turn-On Delay Time
âââ 19 âââ
tr
Rise Time
âââ 56 âââ
td(off)
Turn-Off Delay Time
âââ 100 âââ
tf
Fall Time
âââ 48 âââ
Ciss
Input Capacitance
âââ 9830 âââ
Coss
Output Capacitance
âââ 650 âââ
Crss
Reverse Transfer Capacitance
âââ 260 âââ
h Coss eff. (ER) Effective Output Capacitance (Energy Related) âââ 730 âââ
g Coss eff. (TR) Effective Output Capacitance (Time Related)
âââ 740 âââ
ID = 110A
f nC
VDS = 50V
VGS = 10V
ID = 110A, VDS =0V, VGS = 10V
VDD = 65V
ns
ID = 110A
f RG = 2.7Ω
VGS = 10V
VGS = 0V
VDS = 50V
pF Æ = 1.0MHz
h VGS = 0V, VDS = 0V to 80V
g VGS = 0V, VDS = 0V to 80V
Diode Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
ÃÂ (Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
âââ âââ 186
âââ âââ 740
âââ âââ 1.3
MOSFET symbol
D
showing the
A integral reverse
G
p-n junction diode.
S
f V TJ = 25°C, IS = 110A, VGS = 0V
âââ 60 âââ
âââ 67 âââ
âââ 150 âââ
âââ 180 âââ
ns
TJ = 25°C
TJ = 125°C
nC
TJ = 25°C
TJ = 125°C
VR = 85V,
f IF = 110A
di/dt = 100A/μs
âââ 4.7 âââ A TJ = 25°C
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by max. junction temperature.
 Limited by TJmax, starting TJ = 25°C, L = 0.052mH
RG = 25Ω, IAS = 110A, VGS =10V. Part not recommended for use
above this value .
 ISD ⤠110A, di/dt ⤠1310A/μs, VDD ⤠V(BR)DSS, TJ ⤠175°C.
 Pulse width ⤠400μs; duty cycle ⤠2%.
Â
Coss eff. (TR) is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS.
 Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
 When mounted on 1" square PCB (FR-4 or G-10 Material). For recom-
mended footprint and soldering techniques refer to application note #AN-994.
 Rθ is measured at TJ approximately 90°C.
 RθJC value shown is at time zero.
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