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IRHQ6110 Datasheet, PDF (1/14 Pages) International Rectifier – RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-28) | |||
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PD - 91781B
IRHQ6110
RADIATION HARDENED 100V, Combination 2N-2P-CHANNEL
POWER MOSFET
RAD-Hard⢠HEXFET®
SURFACE MOUNT (LCC-28)
MOSFET TECHNOLOGY
Product Summary
Part Number Radiation Level RDS(on)
IRHQ6110 100K Rads (Si) 0.6â¦
IRHQ63110 300K Rads (Si) 0.6â¦
IRHQ6110 100K Rads (Si) 1.1â¦
IRHQ63110 300K Rads (Si) 1.1â¦
ID
3.0A
3.0A
-2.3A
-2.3A
CHANNEL
N
N
P
P
LCC-28
International Rectifierâs RAD-HardTM HEXFET® MOSFET
Technology provides high performance power MOSFETs
for space applications. This technology has over a decade
of proven performance and reliability in satellite applica-
tions. These devices have been characterized for both
Total Dose and Single Event Effects (SEE). The combina-
tion of low RDS(on) and low gate charge reduces the power
losses in switching applications such as DC to DC con-
verters and motor control. These devices retain all of the
well established advantages of MOSFETs such as voltage
control, fast switching, ease of paralleling and tempera-
ture stability of electrical parameters.
Features:
n Single Event Effect (SEE) Hardened
n Low RDS(on)
n Low Total Gate Charge
n Proton Tolerant
n Simple Drive Requirements
n Ease of Paralleling
n Hermetically Sealed
n Ceramic Package
n Surface Mount
n Light Weight
Absolute Maximum Ratings
ID @ VGS = 12V, TC = 25°C
ID @ VGS = 12V, TC = 100°C
IDM
PD @ TC = 25°C
Parameter
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current â
Max. Power Dissipation
Linear Derating Factor
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current â
Repetitive Avalanche Energy â
Peak Diode Recovery dv/dt
TJ
TSTG
Operating Junction
Storage Temperature Range
Pckg. Mounting Surface Temp.
Weight
Pre-Irradiation
N-Channel
P-Channel Units
3.0
-2.3
1.9
-1.5
A
12
-9.2
12
12
W
0.1
0.1
W/°C
±20
85 â
±20
V
75 â¦
mJ
3.0
-2.3
A
1.2
3.0 â
1.2
9.0 â§
mJ
V/ns
-55 to 150
oC
300 (for 5s)
0.89 (Typical)
g
For footnotes, refer to the last page
www.irf.com
1
03/24/04
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