IRG7PH50UPBF_15 Datasheet, PDF (1/10 Pages) International Rectifier – INSULATED GATE BIPOLAR TRANSISTOR

INSULATED GATE BIPOLAR TRANSISTOR
Features
• Low V_{CE (ON)} trench IGBT technology
• Low switching losses
• Maximum junction temperature 175 °C
• Square RBSOA
• 100% of the parts tested for I_LM
• Positive V_{CE (ON)} temperature co-efficient
• Tight parameter distribution
• Lead -Free
Benefits
• High efficiency in a wide range of applications
• Suitable for a wide range of switching frequencies due to
low V_{CE (ON)} and low switching losses
• Rugged transient performance for increased reliability
• Excellent current sharing in parallel operation
Applications
• U.P.S
• Welding
• Solar inverter
• Induction heating
PD - 97549
IRG7PH50UPbF
IRG7PH50U-EP
C
G
E
n-channel
V_CES = 1200V
I_C = 90A, T_C = 100°C
T_J(max) =175°C
V_CE(on) typ. = 1.7V
C
C
GC ^E
TO-247AC
IRG7PH50UPbF
GC ^E
TO-247AD
IRG7PH50U-EP
G
Gate
C
Collector
E
Emitter
Absolute Maximum Ratings
Parameter
V_CES
I_C @ T_C = 25°C
Collector-to-Emitter Voltage
Continuous Collector Current (Silicon Limited)
I_C @ T_C = 100°C
Continuous Collector Current (Silicon Limited)
I_NOMINAL
Nominal Current
I_CM
Pulse Collector Current, V_GE = 15V
I_LM
c Clamped Inductive Load Current, V_GE = 20V
V_GE
Continuous Gate-to-Emitter Voltage
P_D @ T_C = 25°C
P_D @ T_C = 100°C
Maximum Power Dissipation
Maximum Power Dissipation
T_J
Operating Junction and
T_STG
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
Thermal Resistance
R_θJC (IGBT)
Rθ_CS
Parameter
f Thermal Resistance Junction-to-Case-(each IGBT) TO-247AC
f Thermal Resistance, Case-to-Sink (flat, greased surface)
R_θJA
Thermal Resistance, Junction-to-Ambient (typical socket mount)
1
Max.
1200
140
90
50
150
200
±30
556
278
-55 to +175
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
Min.
–––
–––
–––
Typ.
–––
0.24
40
Max.
0.27
–––
–––
Units
V
A
V
W
°C
Units
°C/W
www.irf.com
07/28/2010