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IRF7811AVTRPBF Datasheet, PDF (1/6 Pages) International Rectifier – N-Channel Application-Specific MOSFETs | |||
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IRF7811APVD-P95b26F5
IRF7811AVPbF
⢠N-Channel Application-Specific MOSFETs
⢠Ideal for CPU Core DC-DC Converters
⢠Low Conduction Losses
⢠Low Switching Losses
⢠Minimizes Parallel MOSFETs for high current
applications
⢠100% RG Tested
⢠Lead-Free
Description
This new device employs advanced HEXFET Power
MOSFET technology to achieve an unprecedented
balance of on-resistance and gate charge. The reduced
conduction and switching losses make it ideal for high
efficiency DC-DC converters that power the latest
generation of microprocessors.
The IRF7811AV has been optimized for all parameters
that are critical in synchronous buck converters including
RDS(on), gate charge and Cdv/dt-induced turn-on immunity.
The IRF7811AV offers an extremely low combination of
Qsw & RDS(on) for reduced losses in both control and
synchronous FET applications.
The package is designed for vapor phase, infra-red,
convection, or wave soldering techniques. Power
dissipation of greater than 2W is possible in a typical
PCB mount application.
Absolute Maximum Ratings
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Output Current
(VGS ⥠4.5V)
 Pulsed Drain Current
TA = 25°C
TL = 90°C
Power Dissipation eÃÃÃÃÃÃÃÃÃÃTA = 25°C
TL = 90°C
Junction & Storage Temperature Range
Continuous Source Current (Body Diode)
 Pulsed Source Current
SO-8
S
1
S
2
S
3
G
4
AA
8
D
7
D
6
D
5
D
Top View
DEVICE CHARACTERISTICSÂ
RDS(on)
QG
QSW
QOSS
IRF7811AV
11 mâ¦
17 nC
6.7 nC
8.1 nC
Symbol
VDS
VGS
ID
IDM
PD
TJ , TSTG
IS
ISM
IRF7811AV
30
±20
10.8
11.8
100
2.5
3.0
-55 to 150
2.5
50
Units
V
A
W
°C
A
Thermal Resistance
Parameter
eh Maximum Junction-to-Ambient
hà Maximum Junction-to-Lead
www.irf.com
Symbol
RθJA
RθJL
Typ
âââ
âââ
Max
50
20
Units
°C/W
1
08/17/04
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