IRF7524D1PBF_15 Datasheet, PDF (1/8 Pages) International Rectifier – Generation 5 Technology

PD -95242
IRF7524D1PbF
FETKY^TM MOSFET & Schottky Diode
l Co-packaged HEXFET® Power
MOSFET and Schottky Diode
l P-Channel HEXFET
l Low V_F Schottky Rectifier
l Generation 5 Technology
l Micro8^TM Footprint
l Lead-Free
Description
A
1
A
2
8
K
7
K
V_DSS = -20V
S
3
6 _{D RDS(on) = 0.27Ω}
G
4
5
D
Schottky Vf = 0.39V
Top View
The FETKY^TM family of co-packaged HEXFETs and Schottky diodes offer the
designer an innovative board space saving solution for switching regulator
applications. Generation 5 HEXFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area. Combining this technology
with International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable electronics
applications like cell phone, PDA, etc.
The new Micro8^TM package, with half the footprint area of the standard SO-8, provides
the smallest footprint available in an SOIC outline. This makes the Micro8^TM an ideal
device for applications where printed circuit board space is at a premium. The low
profile (<1.1mm) of the Micro8^TM will allow it to fit easily into extremely thin application
environments such as portable electronics and PCMCIA cards.
Micro8^TM
Absolute Maximum Ratings
I_D @ T_A = 25°C
I_D @ T_A = 70°C
I_DM
P_D @T_A = 25°C
P_D @T_A = 70°C
V_GS
dv/dt
T_J, T_STG
Parameter
Continuous Drain Current, V_GS @ -4.5V
Pulsed Drain Current À
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt Á
Junction and Storage Temperature Range
Thermal Resistance Ratings
Parameter
R_θJA
Junction-to-Ambient Ã
Maximum
-1.7
-1.4
-14
1.25
0.8
10
± 12
-5.0
-55 to +150
Maximum
100
Units
A
W
mW/°C
V
V/ns
°C
Units
°C/W
Notes:
 Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)
‚ I_SD ≤ -1.2A, di/dt ≤ 100A/µs, V_DD ≤ V_(BR)DSS, T_J ≤ 150°C
ƒ Pulse width ≤ 300µs – duty cycle ≤ 2%
„ When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance
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1
5/12/04