ISL6627_14 Datasheet, PDF (9/11 Pages) Intersil Corporation – VR11.1, VR12 Compatible Synchronous Rectified Buck MOSFET Driver

ISL6627
VCC
BOOT
C_BOOT
DU ^UGATE
G
C_GD
DL
R_GI
VIN
D
C_DS
PHASE
C_GS
S
Q_UPPER
FIGURE 7. GATE TO SOURCE RESISTOR TO REDUCE UPPER
MOSFET MILLER COUPLING
General PowerPAD Design Considerations
Figure 8 shows the recommended use of vias on the thermal pad
to remove heat from the IC. This typical array populates the
thermal pad footprint with vias spaced three times the radius
distance from the center of each via. Small via size is advisable,
but not to the extent that solder reflow becomes difficult.
All vias should be connected to the pad potential, with low
thermal resistance for efficient heat transfer. Complete
connection of the plated-through hole to each plane is important.
It is not recommended to use “thermal relief” patterns to connect
the vias.
FIGURE 8. PCB VIA PATTERN
9
FN6992.1
January 24, 2014