ISL29002 Datasheet, PDF (9/10 Pages) Intersil Corporation – Light-to-Digital I2C Sensor

Typical Circuit
A typical application circuit is shown in Figure 12.
ISL29002
2.5-
3.3V
+
4.7µF
0.1µF
ISL29002
VDD
SDA
SCL
VSS
A2
A1
A0
REXT
100k
MICROCONTROLLER
SDA
SCL
FIGURE 12. TYPICAL CIRCUIT
Suggested PCB Footprint
See Figure 13. Footprint pads should be a nominal 1-to-1
correspondence with package pads. The large, exposed
central die-mounting paddle in the center of the package
requires neither thermal nor electrical connection to the
PCB, and such connection should be avoided.
(2.80 TYP)
(6x0.65)
(2.29)
(8x0.30)
(8x0.60)
(1.40)
FIGURE 13. SUGGESTED PCB FOOTPRINT
Layout Considerations
The ISL29002 is relatively insensitive to layout. Like other
I²C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I²C traces as far as possible from all
sources of noise. Use two power-supply decoupling
capacitors, 4.7µF and 0.1µF, placed close to the device.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The ISL29002’s
plastic ODFN package does not require a custom reflow
soldering profile, and is qualified to +260°C. A standard
reflow soldering profile with a +260°C maximum is
recommended.
Special Handling
ODFN8 is rated as JEDEC moisture level 4. Standard
JEDEC Level 4 procedure should be followed: 72hr floor life
at less than +30°C 60% RH. When baking the device, the
temperature required is +110°C or less due to special
molding compound.
9
FN7465.2
December 1, 2006