HCTS74MS Datasheet, PDF (9/10 Pages) Intersil Corporation – Radiation Hardened Dual-D Flip-Flop with Set and Reset

Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
D1
(2)
HCTS74MS
HCTS74MS
R1
(1)
VCC
(14)
CP1 (3)
NC
S1 (4)
Q1 (5)
(13) R2
(12) D2
NC
(11) CP2
Q1 (6)
(10) S2
(7)
(8)
(9)
GND
Q2
Q2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS74 is TA14438A.
Spec Number 518626
468