HCTS74MS Datasheet, PDF (6/10 Pages) Intersil Corporation – Radiation Hardened Dual-D Flip-Flop with Set and Reset

Specifications HCTS74MS
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
Initial Test (Preburn-In)
Interim Test I (Postburn-In)
Interim Test II (Postburn-In)
PDA
Interim Test III (Postburn-In)
PDA
Final Test
Group A (Note 1)
Group B
Subgroup B-5
METHOD
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
Sample/5005
Sample/5005
GROUP A SUBGROUPS
1, 7, 9
1, 7, 9
1, 7, 9
1, 7, 9, Deltas
1, 7, 9
1, 7, 9, Deltas
2, 3, 8A, 8B, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroup B-6
Sample/5005
1, 7, 9
Group D
Sample/5005
1, 7, 9
NOTES:
1. Alternate Group A testing in accordance with method 5005 of MIL-STD-883 may be exercised.
2. Table 5 parameters only.
READ AND RECORD
ICC, IOL/H
ICC, IOL/H
ICC, IOL/H
ICC, IOL/H
Subgroups 1, 2, 3, 9, 10, 11,
(Note 2)
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
METHOD
PRE RAD
Group E Subgroup 2
5005
1, 7, 9
NOTE:
1. Except FN test which will be performed 100% Go/No-Go.
TEST
POST RAD
Table 4
READ AND RECORD
PRE RAD
POST RAD
1, 9
Table 4 (Note1)
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
OPEN
GROUND
1/2 VCC = 3V ±
0.5V
VCC = 6V ± 0.5V
STATIC BURN-IN I TEST CONNECTIONS
5, 6, 8, 9
1, 2, 3, 4, 7, 10, 11, 12, 13
14
STATIC BURN-IN II TEST CONNECTIONS
5, 6, 8, 9
7
1, 2, 3, 4, 10, 11, 12, 13, 14
DYNAMIC BURN-IN TEST CONNECTIONS
-
7
5, 6, 8, 9
1, 4, 10, 13, 14
NOTES:
1. Each pin except VCC and GND will have a resistor of 10KΩ ± 5% for static burn-in.
2. Each pin except VCC and GND will have a resistor of 1KΩ ± 5% for dynamic burn-in.
OSCILLATOR
50kHz
25kHz
3, 11
2, 12
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V ± 0.5V
5, 6, 8, 9
7
1, 2, 3, 4, 10, 11, 12, 13, 14
NOTE: Each pin except VCC and GND will have a resistor of 47KΩ ± 5% for irradiation testing.
Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number 518626
465