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| HCTS393MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Dual 4-Stage Binary Counter | |||
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Die Characteristics
DIE DIMENSIONS:
86 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS393MS
HCTS393MS
Q0 1 (3)
NC
Q1 1 (4)
(11) 2 Q0
NC
(10) 2 Q1
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS393 is TA14490A.
Spec Number 518633
680
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