HCTS164MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened 8-Bit Serial-In/Parallel-Out Register

HCS164MS
Die Characteristics
DIE DIMENSIONS:
95 x 94mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS164MS
DS2
DS1
VCC
Q7
Q6
(2)
(1)
(14)
(13)
(12)
Q0 (3)
Q1 (4)
NC
(11) Q5
NC
(10) Q4
(5)
(6)
(7)
(8)
Q2
Q3
GND
CP
238
(9)
(MR)
Spec Number 518756