HCTS139MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Dual 2-to-4 Line Decoder/Demultiplexer

Die Characteristics
DIE DIMENSIONS:
2.74mm x 2.68mm
108 mils x 106 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
A0 1
(2)
HCTS139MS
HCTS139MS
E1 1
VCC
E2
(1)
(16)
(15)
A1 1 (3)
Y0 1 (4)
Y1 1 (5)
(14) 2 A0
(13) 2 A1
(12) 2 Y0
(11) 2 Y1
Y2 2 (6)
(10) 2 Y2
(7)
Y3 1
(8)
GND
(9)
2 Y3
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS139 is TA14409.
Spec Number 518606
528