HCTS138MS_05 Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Inverting 3-to-8 Line Decoder/Demultiplexer

HCTS138MS
Die Characteristics
DIE DIMENSIONS:
85 x 101 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCTS138MS
A1
A0
VCC
Y0
(2)
(1)
(16)
(15)
A2 (3)
NC
E1 (4)
E2 (5)
E3 (6)
NC
(14) Y1
NC
(13) Y2
(12) Y3
(11) Y4
NC
(7)
(8)
(9)
(10)
Y7
GND
Y6
Y5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The
mask series for the HCTS138 is TA14461A.
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FN2462.3
September 12, 2005