HCS195MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Inverting 8-Bit Parallel-Input/Serial Output Shift Register

HCS195MS
Die Characteristics
DIE DIMENSIONS:
95 x 94 mils
2.380 x 2.410mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS195MS
J
MR
VCC
Q0
Q1
(2)
(1)
(16)
(15)
(14)
K (3)
D0 (4)
D1 (5)
(13) Q2
(12) Q3
(11)Q3
(6)
(7)
(8)
(9)
(10)
D2
D3
GND
PE
CP
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS195 is TA14387A.
Spec Number 518760
288