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| HCS190MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Synchronous 4-Bit Up/Down Counter | |||
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Die Characteristics
DIE DIMENSIONS:
104 x 86 (mils)
2.65 x 2.19 (mm)
METALLIZATION:
Type: Si - Al
Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105 A/cm2
BOND PAD SIZE:
4 x 4 (mils)
100 x 100µm
Metallization Mask Layout
HCS190MS
HCS190MS
Q0 (3)
CE (4)
U/D (5)
Q2 (6)
Q3 (7)
(15) P0
(14) CP
(13) RC
(12) TC
(11) PL
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS190 is TA14344A.
Spec Number 518836
268
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