HCS166MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register

HCS166MS
Die Characteristics
DIE DIMENSIONS:
94 x 94 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS166MS
D1
D0
DS
VCC
PE
(3)
(2)
(1)
(16)
(15)
D2 (4)
D3 (5)
CE (6)
(14) D7
(13) Q7
(12) D6
(7)
(8)
(9)
(10)
(11)
CP
GND
MR
D4
D5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS166 is TA14386A.
Spec Number 518758
258