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| HCS163MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Synchronous Presettable Counter | |||
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Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS163MS
HCS163MS
CP
MR
VCC
TC
P0
Q0
P1
Q1
P2
Q2
P3
Q3
PE
GND SPE
TE
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS163 is TA14348A.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiï¬cation.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciï¬cations at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518835
228
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