HCS151MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened 8-Input Multiplexer

Die Characteristics
DIE DIMENSIONS:
84 x 84 mils
2.13 x 2.13mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
I2
(2)
HCS151MS
HCS151MS
I3
VCC
I4
(1)
(16)
(15)
I1 (3)
I0 (4)
Y (5)
Y (6)
(14) I5
(13) I6
(12) I7
(11) S0
(10) S1
(7)
(8)
(9)
E
GND
S2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS151 is TA14467A.
Spec Number 518753
171