HCS138MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Inverting 3-to-8 Line Decoder/Demultiplexer

Die Characteristics
DIE DIMENSIONS:
85 x 101 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
A1
(2)
HCS138MS
HCS138MS
A0
VCC
Y0
(1)
(16)
(15)
A2 (3)
NC
E1 (4)
E2 (5)
E3 (6)
NC
(14) Y1
NC
(13) Y2
(12) Y3
(11) Y4
NC
(7)
(8)
(9)
(10)
Y7
GND
Y6
Y5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS138 is TA14361A.
Spec Number 518751
151