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| HCS109MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Dual JK Flip Flop | |||
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Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
J1
(2)
HCS109MS
HCS109MS
R1
(1)
VCC
(16)
K1 (3)
CP1 (4)
S1 (5)
Q1 (6)
(15) R2
(14) J2
(13) K2
(12) CP2
Q1 (7)
(11) S2
(8)
GND
(9)
(10)
Q2
Q2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS109 is TA14340A.
Spec Number 518748
111
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