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| HCTS08MS Datasheet, PDF (8/10 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input AND Gate | |||
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
B1 (2)
HCTS08MS
HCTS08MS
A1
VCC
B4
(1)
(14)
(13)
Y1 (3)
A2 (4)
B2 (5)
(6)
(7)
(8)
Y2
GND
Y3
(12) A4
(11) Y4
(10) B3
(9) A3
Spec Number 518842
8
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