HCS21MS Datasheet, PDF (8/8 Pages) Intersil Corporation – Radiation Hardened Dual 4-Input AND Gate

Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: AlSil
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS21MS
HCS21MS
A1
VCC
C1
(1)
(14)
(13)
B1 (2)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
Y2
GND
Y3
60
(12) Y1
(11) C3
(10) B3
(9) A3
Spec Number 518762