HCS20MS Datasheet, PDF (8/8 Pages) Intersil Corporation – Radiation Hardened Dual 4-Input NAND Gate

Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS20MS
HCS20MS
A1
VCC
D2
(1)
(14)
(13)
B1 (2)
NC (3)
C1 (4)
D1 (5)
(6)
(7)
(8)
Y1
GND
Y2
50
(12) C2
(11) NC
(10) B2
(9) A2
Spec Number 518761