HCS132MS Datasheet, PDF (8/8 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input NAND Schmitt Trigger

Die Characteristics
DIE DIMENSIONS:
90 x 90 mils
2.29 x 2.29mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
B1
(2)
HCS132MS
HCS132MS
A1
VCC
B4
(1)
(14)
(13)
Y1 (3)
A2 (4)
B2 (5)
NC
NC
(12) A4
(11) Y4
(10) B3
(6)
(7)
Y2
GND
(8)
(9)
Y3
A3
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS132 is TA14383A.
Spec Number 518750
140