CD4069UBMS Datasheet, PDF (8/8 Pages) Intersil Corporation – CMOS Hex Inverter

1/6 CD4069
IN
OUT
CD4069UBMS
1/3 CD4069
RS
RT
CT
Rf ≈ 10 MEG
FIGURE 15. HIGH-INPUT IMPEDANCE AMPLIFIER
1/6 CD4069
Rf
XTAL
FOR TYPICAL COMPONENT
VALUES AND CIRCUIT
PERFORMANCE, SEE
APPLICATION NOTES:
AN-6086 AND AN-6539
RS
CS
CT
FIGURE 17. TYPICAL CRYSTAL OSCILLATOR CIRCUIT
Chip Dimensions and Pad Layout
FOR TYPICAL COMPONENT
VALUES AND CIRCUIT PERFORMANCE,
SEE APPLICATION NOTE AN-6466
FIGURE 16. TYPICAL RC OSCILLATOR CIRCUIT
RS
IN
1/3 CD4069
OUT
Rf
UPPER SWITCHING POINT
RS + Rf
VP ≈
Rf
VDD
2
•
LOWER SWITCHING POINT
VN ≈
Rf - RS ^VDD
Rf
2
•
Rf > RS
FIGURE 18. INPUT PULSE SHAPING CIRCUIT
(SCHMITT TRIGGER)
6
5
4
3
2
7
1
DIE SIZE:
48 X 48 (45 - 53)
(1.143 - 1.346)
14
8
13
9
10
11
12
Dimension in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10^-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-471