CD4010BMS Datasheet, PDF (8/8 Pages) Intersil Corporation – CMOS Hex Buffer/Converter

CD4010BMS
Typical Performance Characteristics (Continued)
10⁴
8
6
4
AMBIENT TEMPERATURE
(T_A) = +25^oC
2 _{SUPPLY VOLTAGE}
10^{38 (VDD) = 15V}
6
4
10V
10V
2
10²
5V
8
6
4
2
LOAD CAPACITANCE (CL) = 50pF
CL = 15pF
10
10 ²
4 6 8 ₁₀₂ 2
4 6 8 ₁₀₃ 2
4 6 8 ₁₀₄
INPUT FREQUENCY (fφ) kHz
FIGURE 13. TYPICAL DISSIPATION CHARACTERISTICS
Chip Dimensions and Pad Layouts
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10^-3 inch)
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