ISL3330_14 Datasheet, PDF (7/25 Pages) Intersil Corporation – 3.3V, ±15kV ESD Protected, Dual Protocol (RS-232/RS-485) Transceivers

ISL3330, ISL3331
Absolute Maximum Ratings (T_A = +25°C)
V_CC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
V_L (QFN Only) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V_CC + 0.5V
Input Voltages
All Except A,B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Input/Output Voltages
A, B (Any Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V to +25V
Y, Z (Any Mode, Note 5) . . . . . . . . . . . . . . . . . . . -12.5V to +12.5V
R_A, R_B (Non-QFN Package) . . . . . . . . . . . -0.5V to (V_CC + 0.5V)
R_A, R_B (QFN Package) . . . . . . . . . . . . . . . . -0.5V to (V_L + 0.5V)
Output Short Circuit Duration
Y, Z, R_A, R_B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
20 Ld SSOP Package (Note 6) . . . . . .
55
N/A
40 Ld QFN Package (Notes 7, 8). . . . .
31
2.5
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
5. One output at a time, I_OUT ≤ 100mA for ≤ 10 minutes.
6. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
7. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
8. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
Test Conditions: V_CC = 3.15V to 3.45V, C₁ to C₄ = 0.1µF, V_L = V_CC (for QFN only), Unless Otherwise Specified.
Typicals are at V_CC = 3.3V, T_A = +25°C (Note 9)
SYMBOL
TEST CONDITIONS
TEMP MIN
MAX
(°C) (Note 15) TYP (Note 15) UNITS
DC CHARACTERISTICS - RS-485 DRIVER (485/232 = V_CC)
Driver Differential V_OUT (no load) V_OD1
Driver Differential V_OUT (with load) V_OD2 R = 50Ω (RS-422) (Figure 1)
R = 27Ω (RS-485) (Figure 1)
Full
-
Full
2
-
V_CC
V
2.3
-
V
Full
1.5
2
5
V
V_OD3 R_D = 60Ω, R = 375Ω, V_CM = -7V to 12V
(Figure 1)
Full
1.5
-
5
V
Change in Magnitude of Driver
Differential V_OUT for
Complementary Output States
ΔV_OD R = 27Ω or 50Ω (Figure 1)
Full
-
0.01
0.2
V
Driver Common-Mode V_OUT
Change in Magnitude of Driver
Common-Mode V_OUT for
Complementary Output States
V_OC
ΔV_OC
R = 27Ω or 50Ω (Figure 1)
R = 27Ω or 50Ω (Figure 1)
Full
-
Full
-
-
3.0
V
0.01
0.2
V
Driver Short-Circuit Current,
V_OUT = High or Low
I_OS -7V ≤ (V_Y or V_Z) ≤ 12V (Note 11)
Full
35
-
250
mA
Driver Three-State Output Leakage I_OZ Outputs Disabled,
Current (Y, Z)
V_CC = 0V or 3.45V
V_OUT = 12V Full
-
-
150
µA
V_OUT = -7V
Full
-150
-
-
µA
DC CHARACTERISTICS - RS-232 DRIVER (485/232 = 0V)
Driver Output Voltage Swing
V_O All T_OUTS Loaded with 3kΩ to Ground
Driver Output Short-Circuit Current I_OS V_OUT = 0V
DC CHARACTERISTICS - LOGIC PINS (i.e., DRIVER AND CONTROL INPUT PINS)
Full
±5.0
-
Full
-60
-
-
V
60
mA
Input High Voltage
V_IH1
V_IH2
V_IH3
V_IH4
V_IH5
V_L = V_CC if QFN
2.7V ≤ V_L < 3.0V (QFN Only)
2.3V ≤ V_L < 2.7V (QFN Only)
1.6V ≤ V_L < 2.3V (QFN Only)
1.2V ≤ V_L < 1.6V (QFN Only)
Full
2.2
-
V
Full
2
-
V
Full
1.6
-
V
Full 0.7*V_L
-
V
25
-
0.7*V_L
-
V
7
FN6361.0
May 20, 2008