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| DG300A Datasheet, PDF (7/7 Pages) Intersil Corporation – TTL-Compatible, CMOS Analog Switches | |||
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Die Characteristics
DIE DIMENSIONS:
89 mils x 99 mils x 12 mils
METALLIZATION:
Type: Al
Thickness: 10kÃ
±1kÃ
Metallization Mask Layouts
DG300A
PIN 2
D1
PIN 14
V+
DG300A, DG301A, DG303A
PIN 13
D2
PASSIVATION:
Type: PSG Over Nitride
PSG Thickness: 7kÃ
±1.4kÃ
Nitride Thickness: 8kÃ
±1.2kÃ
WORST CASE CURRENT DENSITY:
1 x 105 A/cm2
PIN 2
D1
DG301A
PIN 14
V+
PIN 4
S1
PIN 11
S2
PIN 4
S1
PIN 13
D2
PIN 11
S2
PIN 6
IN 1
PIN 7
NC GND
PIN 8
V-
PIN 9
IN 2
PIN 2
S3
DG303A
PIN 14
V+
PIN 6
IN 1
PIN 7 PIN 8
NC GND
V-
PIN 13
S4
PIN 3
D3
PIN 4
D1
PIN 12
D4
PIN 11
D2
PIN 5
S1
PIN 10
S2
PIN 6
IN 1
PIN 7
NC GND
PIN 8
V-
PIN 9
IN 2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiï¬cation.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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