CD4049UBMS_07 Datasheet, PDF (7/11 Pages) Intersil Corporation – CMOS Hex Buffer/Converter

CD4049UBMS
CONFORMANCE GROUPS
Group E Subgroup 2
TABLE 3. TOTAL DOSE IRRADIATION
MIL-STD-883
METHOD
TEST
PRE-IRRAD
POST-IRRAD
5005
1, 7, 9
Table 4
READ AND RECORD
PRE-IRRAD
POST-IRRAD
1, 9
Table 4
TABLE 4. BURN-IN AND IRRADIATION TEST CONNECTIONS
OSCILLATOR
FUNCTION
OPEN
GROUND
VDD
9V ± -0.5V
50kHz
25kHz
Static Burn-In 1 (Note 14) 2, 4, 6, 10, 12, 13, 15 3, 5, 7-9, 11-14
1, 16
Static Burn-In 2 (Note 14) 2, 4, 6, 10, 12, 13, 15
8
1, 3, 5, 7, 9, 11, 14, 16
Dynamic Burn-In
13
8
1, 16
2, 4, 6, 10, 12, 15 3, 5, 7, 9, 11, 14
(Note 16)
Irradiation (Note 15)
2, 4, 6, 10, 12, 13, 15, 16
8
1, 3, 5, 7, 9, 11, 14
NOTES:
14. Each pin except pin 1, pin 16, and GND will have a series resistor of 10k ± 5%, V_DD = 18V ± 0.5V
15. Each pin except pin 1, pin 16, and GND will have a series resistor of 47k ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
V_DD = 10V ± 0.5V
16. Each pin except pin 1, pin 16, and GND will have a series resistor of 4.75k ± 5%, V_DD = 18V ± 0.5V
Typical Performance Characteristics
AMBIENT TEMPERATURE (T_A) = +25°C
SUPPLY VOLTAGE (V_CC) = 5V
5
4
MINIMUM
MAXIMUM
3
2
1
0
1
2
3
4
INPUT VOLTAGE (VI) (V)
FIGURE 2. MINIMUM AND MAXIMUM VOLTAGE TRANSFER
CHARACTERISTICS
AMBIENT TEMPERATURE (T_A) = +25°C
70
15V
10V
60
50
40
30
GATE-TO-SOURCE VOLTAGE (V_GS) = 5V
20
10
0
1
2
3
4
5
6
7
8
DRAIN-TO-SOURCE VOLTAGE (V_DS) (V)
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
7
FN3315.1
March 6, 2007