RHR1K160D Datasheet, PDF (6/9 Pages) Intersil Corporation – 1A, 600V Hyperfast Dual Diode

RHR1K160D
.
T_J1 = P₁R_θJA + P₂R_θβ + T_A
T_J1 = (0W)(168^oC/W) + (0.5W)(96^oC/W) + 60^oC
T_J1 = 108^oC
(EQ. 4)
T_J2 = P₂R_θJA + P₁R_θβ + T_A
T_J2 = (0.5W)(168^oC/W) + (0W)(96^oC/W) + 60^oC
T_J2 = 144^oC
(EQ. 5)
The transient thermal impedance (Z_θJA) is also effected by
varied top copper board area. Figure 14 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. SPICE and SABER thermal models are provided for
each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM6 and RTHERM1 through
RTHERM5 remain constant for each of the thermal models.
A listing of the model component values is available in Table 1.
200
COPPER BOARD AREA - DESCENDING ORDER
0.020 in²
0.140 in²
150 _{0.257 in2}
0.380 in²
0.483 in²
100
50
0
10^-1
10⁰
10¹
10²
10³
t, RECTANGULAR PULSE DURATION (s)
FIGURE 14. TRANSIENT THERMAL IMPEDANCE vs MOUNTING PAD AREA
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