ISL1536_14 Datasheet, PDF (6/9 Pages) Intersil Corporation – Dual Channel Central Office ADSL2+ Line Driver

Typical Performance Curves (Continued)
(±V_S
FIGURE 11. DIFFERENTIAL 3dB BANDWIDTH vs SUPPLY
VOLTAGE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - THERMAL PAD
NOT CONNECTED TO BOARD
1.2
1.0
833mW
0.8
0.6
QFN16
0.4 θ_JA = +150°C/W
0.2
0
0
25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 13. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 12. CHANNEL SEPARATION vs FREQUENCY
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
4.5
4.0
3.5 _3.125W
3.0
2.5
2.0
1.5
1.0
QFN16
θ_JA = +40°C/W
0.5
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 14. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
6
FN6508.4
February 15, 2013