HCTS273MS Datasheet, PDF (6/10 Pages) Intersil Corporation – Radiation Hardened Octal D Flip-Flop

Specifications HCTS273MS
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
METHOD
TEST
PRE RAD
POST RAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
NOTE:
1. Except FN test which will be performed 100% Go/No-Go.
READ AND RECORD
PRE RAD
POST RAD
1, 9
Table 4 (Note 1)
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
OSCILLATOR
OPEN
GROUND
1/2 VCC = 3V ± 0.5V VCC = 6V ± 0.5V
50kHz
25kHz
STATIC BURN-IN I TEST CONNECTIONS
2, 5, 6, 9, 12, 15, 1, 3, 4, 7, 8, 10, 11,
-
16, 19
13, 14, 17, 18
20
-
-
STATIC BURN-IN II TEST CONNECTIONS
2, 5, 6, 9, 12, 15,
10
16, 19
-
1, 3, 4, 7, 8, 11, 13,
-
-
14, 17, 18, 20
DYNAMIC BURN-IN TEST CONNECTIONS
-
10
2, 5, 6, 9, 12, 15,
1, 20
11
3, 4, 7, 8, 13,
16, 19
14, 17, 18
NOTES:
1. Each pin except VCC and GND will have a resistor of 10kΩ ± 5% for static burn-in
2. Each pin except VCC and GND will have a resistor of 680Ω ± 5% for dynamic burn-in
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V ± 0.5V
2, 5, 6, 9, 12, 15, 16, 19
10
1, 3, 4, 7, 8 11, 13, 14, 17, 18, 20
NOTE: Each pin except VCC and GND will have a resistor of 47KΩ ± 5% for irradiation testing.
Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number 518642
6