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ISL6144_07 Datasheet, PDF (5/29 Pages) Intersil Corporation – High Voltage ORing MOSFET Controller
ISL6144
Absolute Maximum Ratings TA = +25°C
VIN, VOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +100V
GATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VIN +12V
HVREF. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VIN -5V
COMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VOUT
VSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VOUT -5V
FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 16V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA (°C/W) θJC (°C/W)
TSSOP Package (Note 1) . . . . . . . . . .
90
N/A
QFN Package (Notes 3, 4). . . . . . . . . .
35
5
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
Operating Conditions
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . +10 to +75V
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . -40°C to +105°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
+150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Operation close to +150°C junction may trigger the shutdown of
the device even before +150°C, since this number is specified as typical.
NOTES:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. (See Tech Brief, #TB379.1 for
details.)
2. All voltages are relative to GND, unless otherwise specified.
3. For θJC, the "case temp" location is the center of the exposed metal pad on the package underside.
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “die attach” features. (See Tech
Brief, #TB379 for details.)
Electrical Specifications VIN = 48V, TA = -40°C to +105°C, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
BIAS “VIN”
POR Rising
12V Bias Current
48V Bias Current
75V Bias Current
GATE
PORL2H
I12V
I48V
I75V
VIN Rising to VGATE > VIN + 7.5V
VIN = 12V, VGATE = VIN + VGQP
VIN = 48V, VGATE = VIN + VGQP
VIN = 75V, VGATE = VIN + VGQP
Charge Pump Voltage
Gate Low Voltage Level
Low Pull Down Current
High Pull Down Current
VGQP
VGL
IPDL†
(Note 5)
IPDH†
(Note 5)
VIN = 12V to 75V
VIN - VOUT < 0V
Cgs = 39nF, IPDL = Cgs * dVgs/Ttofs
Cgs = 39nF, IPDH = Cgs * dVgs/Ttoff
Slow Turn-off Time
Fast Turn-off Time
ttoffs
ttoff
Cgs = 39nF
Turn-off from VGATE = VIN + VGQP to VIN + 1V with
Cgs = 39nF (includes HS Comparator delay time)
Start-up “Turn-On” Time
GATE Turn-On Current
tON
ION†
(Note 5)
Turn-on from VGATE = VIN to VIN + 7.5V into 39nF
VIN = 10V to 75V
CONTROL AND REGULATION I/O
HR Amplifier Forward Voltage
Regulation
HS COMP Externally
Programmable Threshold
VFWD_HR
VTH(HS)†
(Note 5)
ISL6144 controls voltage across FET Vds to
VFWD_HR during static forward operation at loads
resulting in I * rDS(ON) < VFWD_HR
Externally programmable threshold for noise
sensitivity (system dependent), typical 0.05 to 0.3V
HS Comparator Offset Voltage
VOS(HS)
MIN
TYP
MAX UNITS
10
-
-
3.5
-
4.5
-
5
-
V
-
mA
-
mA
-
mA
VIN + 9 VIN + 10.5 VIN + 12 V
-0.3
VIN VIN + 0.5 V
-
5
-
mA
-
2
-
A
-
-
100
µs
-
250
300
ns
-
1
-
ms
-
1
-
mA
10
20
30
mV
0
0.05
5.3
V
-40
0
25
mV
5
FN9131.3
February 15, 2007