ISL31470E_10 Datasheet, PDF (5/21 Pages) Intersil Corporation – Fault Protected, Extended Common Mode Range, RS-485/RS-422 Transceivers

ISL31470E, ISL31472E, ISL31475E, ISL31478E
Absolute Maximum Ratings
V_CC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . -0.3V to (V_CC + 0.3V)
Input/Output Voltages
A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . ±60V
A/Y, B/Z, A, B, Y, Z
(Transient Pulse Through 100Ω, Note 17) . . . . . . . ±80V
RO . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V_CC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . see Specification Table
Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . +125°C
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
8 Ld PDIP* Package (Notes 5, 7) . . . 105
60
8 Ld SOIC Package (Notes 6, 7). . . . 116
47
14 Ld SOIC Package (Notes 6, 7) . . . 88
39
Maximum Junction Temperature (Plastic Package) . . . .+150°C
Maximum Storage Temperature Range . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through-hole wave solder
processing only. They are not intended for use in Reflow
solder processing applications.
Recommended Operating Conditions
Supply Voltage (V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
Bus Pin Common Mode Voltage Range . . . . . . -15V to +15V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
5. θ_JA is measured with the component mounted on a low effective thermal conductivity test board in free air.
6. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
7. For θ_JC, the “case temp” location is taken at the package top center.
Electrical Specifications Test Conditions: V_CC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V_CC = 5V,
T_A = +25°C (Note 8). Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP MIN
MAX
(°C) (Note 16) TYP (Note 16) UNITS
DC CHARACTERISTICS
Driver Differential V_OUT
(No load)
V_OD1
Full
-
-
V_CC
V
Driver Differential V_OUT
(Loaded, Figure 1A)
V_OD2
R_L = 100Ω (RS-422)
R_L = 54Ω (RS-485)
Full
2.4
3.2
-
V
Full
1.5
2.5
V_CC
V
R_L = 54Ω (PROFIBUS, V_CC ≥ 5V)
Full
2.0
2.5
-
R_L = 21Ω (Six 120Ω terminations for Full
0.8
1.3
-
V
Star Configurations, V_CC ≥ 4.75V)
Change in Magnitude of Driver
Differential V_OUT for
Complementary Output States
ΔV_OD R_L = 54Ω or 100Ω (Figure 1A)
Full
-
-
0.2
V
Driver Differential V_OUT with
Common Mode Load
(Figure 1B)
Driver Common-Mode V_OUT
(Figure 1A)
V_OD3
V_OC
R_L = 60Ω, -7V ≤ V_CM ≤ 12V
R_L = 60Ω, -15V ≤ V_CM ≤ 15V
(V_CC ≥ 4.75V)
R_L = 54Ω or 100Ω
Full
1.5
2.1
V_CC
V
Full
1.7
2.3
-
v
Full
-1
-
3
V
Change in Magnitude of Driver
Common-Mode V_OUT for
Complementary Output States
ΔV_OC R_L = 54Ω or 100Ω (Figure 1A)
Full
-
-
0.2
V
Driver Short-Circuit Current
I_OSD DE = V_CC, -15V ≤ V_O ≤ 15V (Note 10) Full
-250
-
250
mA
I_OSD1 At First Fold-back, 22V ≤ V_O ≤ -22V Full
-83
-
83
mA
I_OSD2 At Second Fold-back, 35V ≤ V_O ≤ -35V Full
-13
-
13
mA
5
FN7639.0
June 17, 2010