DG308A Datasheet, PDF (5/7 Pages) Intersil Corporation – Quad Monolithic SPST, CMOS Analog Switch

Die Characteristics
DIE DIMENSIONS:
2058µm x 2109µm
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
Metallization Mask Layout
DG308A
PASSIVATION:
Type: PSG Over Nitride
PSG Thickness: 7kÅ ±1.4kÅ
Nitride Thickness:8kÅ ±1.2kÅ
WORST CASE CURRENT DENSITY:
9.1 x 10⁴ A/cm²
DG308A
PIN 14
S2
PIN 13
V+ (SUBSTRATE)
PIN 11
S3
PIN 15
D2
PIN 16
IN2
PIN 1
D1
PIN 2
IN1
PIN 10 D3
PIN 9 IN3
PIN 8 IN4
PIN 7 D4
PIN 3
S1
PIN 4
V-
PIN 5
GND
PIN 6
54
5