ZL2103 Datasheet, PDF (4/28 Pages) Intersil Corporation – 3A Digital-DC Synchronous Step-Down DC/DC Converter

ZL2103
Pin Descriptions (Continued)
TYPE
PIN
LABEL
(Note 1)
DESCRIPTION
31
VR
PWR Regulated bias from internal 7V low-dropout regulator (return is PGND). Decouple with a 4.7µF capacitor to
PGND.
32
VRA
PWR Regulated bias from internal 5V low-dropout regulator for internal analog circuitry (return is SGND).
Decouple with a 4.7µF capacitor to SGND.
33
V2P5
PWR Regulated bias from internal 2.5V low-dropout regulator for internal digital circuitry (return is DGND).
Decouple with a 10µF capacitor.
34
DDC
I/O
Digital-DC Bus (open drain). Interoperability between Zilker Labs devices.
35
MGN
I
Margin pin. Used to enable margining of the output voltage.
36
EN
I
Enable pin. Used to enable the device (active high).
ePad
SGND
PWR Exposed thermal pad. Common return for analog signals. Connect to low impedance ground plane.
NOTES:
1. I = Input, O = Output, PWR = Power or Ground, M = Multi-mode pins. Please refer to Section “Multi-mode Pins” on page 12.
2. The SYNC pin can be used as a logic pin, a clock input or a clock output.
Ordering Information
PART NUMBER
(Notes 4, 5)
PART
MARKING
TEMP RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ZL2103ALAF
2103
-40 to +85
36 Ld 6mmx6mm QFN
L36.6x6C
ZL2103ALAFT (Note 3)
2103
-40 to +85
36 Ld 6mmx6mm QFN
L36.6x6C
ZL2103ALAFTK (Note 3)
2103
-40 to +85
36 Ld 6mmx6mm QFN
L36.6x6C
ZL2103EVAL1Z
Evaluation Board
NOTES:
3. Please refer to TB347 for details on reel specifications.
4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
5. For Moisture Sensitivity Level (MSL), please see device information page for ZL2103. For more information on MSL please see techbrief TB363.
4
FN6966.5
May 3, 2011