ISL6609_06 Datasheet, PDF (4/11 Pages) Intersil Corporation – Synchronous Rectified MOSFET Driver

ISL6609, ISL6609A
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V_EN, V_PWM) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V_BOOT-GND). . . -0.3V to 25V (DC) or 36V (<200ns)
BOOT To PHASE Voltage (V_BOOT-PHASE) . . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V (DC)
GND -8V (<20ns Pulse Width, 10µJ) to 30V (<100ns)
UGATE Voltage . . . . . . . . . . . . . . . . V_PHASE - 0.3V (DC) to V_BOOT
V_PHASE - 5V (<20ns Pulse Width, 10µJ) to V_BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 125°C
HBM ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV
Thermal Information
Thermal Resistance (Notes 1, 2, 3)
θ_JA(°C/W) θ_JC(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . .
110
N/A
QFN Package (Notes 2, 3). . . . . . . . . .
95
36
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 100°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
3. θ_JC, “case temperature” location is at the center of the package underside exposed pad. See Tech Brief TB379 for details.
Electrical Specifications These specifications apply for T_A = -40°C to 100°C, unless otherwise noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current
POR Rising
I_VCC
PWM pin floating, V_VCC = 5V
-
132
-
µA
-
3.4
4.2
POR Falling
2.2
3.0
-
Hysteresis
PWM INPUT
Sinking Impedance
Source Impedance
Three-State Rising Threshold
Three-State Falling Threshold
Three-State Shutdown Holdoff Time
EN INPUT
R_{PWM_SNK}
R_{PWM_SRC}
V_VCC = 5V (100mV Hysteresis)
V_VCC = 5V (100mV Hysteresis)
t_TSSHD t_PDLU or t_PDLL + Gate Falling Time
-
400
-
mV
2.75
4
5.5
kΩ
3
4.25 5.75
kΩ
-
1.70 2.00
V
3.10 3.41
-
V
-
20
-
ns
EN LOW Threshold
1.0
1.3
-
V
EN HIGH Threshold
SWITCHING TIME (See Figure 1 on Page 6)
UGATE Rise Time (Note 4)
LGATE Rise Time (Note 4)
UGATE Fall Time (Note 4)
LGATE Fall Time (Note 4)
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
t_RU
t_RL
t_FU
t_FL
t_PDLU
t_PDLL
V_VCC = 5V, 3nF Load
V_VCC = 5V, 3nF Load
V_VCC = 5V, 3nF Load
V_VCC = 5V, 3nF Load
V_VCC = 5V, Outputs Unloaded
V_VCC = 5V, Outputs Unloaded
-
1.6
2.0
V
-
8.0
-
ns
-
8.0
-
ns
-
8.0
-
ns
-
4.0
-
ns
-
18
-
ns
-
25
-
ns
4
FN9221.1
March 6, 2006