ISL54227_10 Datasheet, PDF (4/18 Pages) Intersil Corporation – High-Speed USB 2.0 (480Mbps) DPST Switch with Overvoltage Protection (OVP) and Dedicated Charger Port Detection

ISL54227
Absolute Maximum Ratings
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.5V
VDD to COMx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5V
COMx to Dx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8.6V
Input Voltages
D+, D- . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
COM+, COM- . . . . . . . . . . . . . . . . . . . . . . . -5V to 6.5V
OE, LP . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.5V
Continuous Current (COM-/D-, COM+/D+) . . . . . . . ±40mA
Peak Current (COM-/D-, COM+/D+)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA
ESD Rating:
Human Body Model (Tested per JESD22-A114-F). . . . >2kV
Machine Model (Tested per JESD22-A115-A) . . . . . . >150V
Charged Device Model (Tested per JESD22-C101-D) . >2kV
Latch-up (Tested per JEDEC; Class II Level A) . . . . at +85°C
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
10 Ld µTQFN Package (Note 6, 9) . 210
165
10 Ld TDFN Package (Notes 7, 8). . 58
22
Maximum Junction Temperature (Plastic Package). . +150°C
Maximum Storage Temperature Range. . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Normal Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
V_DD Supply Voltage Range . . . . . . . . . . . . . . 2.7V to 5.25V
Logic Control Input Voltage . . . . . . . . . . . . . . . 0V to 5.25V
Analog Signal Range, V_DD = 2.7V to 5.25V . . . . . 0V to 3.6V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
6. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
7. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
8. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
9. For θ_JC, the “case temp” location is taken at the package top center.
Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: V_DD = +3.3V, GND = 0V, V_LP = GND, V_OEH = 1.4V,
V_OEL = 0.5V, (Note 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
MIN
MAX
(°C) (Notes 11, 12) TYP (Notes 11, 12) UNITS
ANALOG SWITCH CHARACTERISTICS
ON-Resistance, r_ON
V_DD = 2.7V, OE = 1.4V, I_Dx = 17mA,
25
-
3.5
5
Ω
(High-Speed)
V_COM+ or V_COM- = 0V to 400mV
(see Figure 2, Note 15)
Full
-
-
7
Ω
r_ON Matching Between
V_DD = 2.7V, OE = 1.4V, I_Dx = 17mA,
25
-
0.2
0.45
Ω
Channels, Δr_ON (High-Speed) V_COM+ or V_COM- = Voltage at max r_ON,
(Notes 14, 15)
Full
-
-
0.55
Ω
r_ON Flatness, R_FLAT(ON)
V_DD = 2.7V, OE = 1.4V, I_Dx = 17mA,
25
-
0.26
1
Ω
(High-Speed)
V_COM+ or V_COM- = 0V to 400mV,
(Notes 13, 15)
Full
-
-
1.2
Ω
ON-Resistance, r_ON
V_DD = 3.3V, OE = 1.4V, I_COMx = 17mA, +25
-
6.8
17
Ω
V_COM+ or V_COM- = 3.3V
(see Figure 2, Note 15)
Full
-
-
22
Ω
OFF Leakage Current,
V_DD = 5.25V, OE = 0V, V_Dx = 0.3V, 3.3V, 25
-20
1
20
nA
I_Dx(OFF)
V_COMX = 3.3V, 0.3V
Full
-
30
-
nA
ON Leakage Current, I_Dx(ON) V_DD = 5.25V, OE = 5.25V, V_Dx = 0.3V,
25
-9
-
9
µA
3.3V, V_COMX = 0.3V, 3.3V
Full
-12
-
12
µA
Power OFF Leakage Current, V_DD = 0V, V_COM+ = 5.25V,
I_COM+, I_COM-
V_COM- = 5.25V, OE = 0V
25
-
Power OFF Logic Current, I_OE V_DD = 0V, OE = 5.25V
25
-
Power OFF D+/D- Current, V_DD = 0V, OE = V_DD, V_D+ = V_D- = 5.25V 25
-
I_D+, I_D-
-
11
µA
-
22
µA
-
1
µA
4
FN7593.0
July 2, 2010