English
Language : 

ISL3179E Datasheet, PDF (4/17 Pages) Intersil Corporation – High ESD Protected, +125°C, 40Mbps 3.3V, Full Fail-Safe, RS-485/RS-422 Transceivers
ISL3179E, ISL3180E
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A, B, Y, Z, A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 1, 2) θJA (°C/W) θJC (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . 160
N/A
14 Ld SOIC Package . . . . . . . . . . . . . . 128
N/A
8 Ld MSOP Package . . . . . . . . . . . . . . 137
N/A
10 Ld DFN Package. . . . . . . . . . . . . . .
46
3.5
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range
ISL3179EF . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
ISL3179EI, ISL3180EI . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θJA is measured with the component mounted on a high effective thermal conductivity (with direct attach for DFN) test board in free air. See Tech
Brief TB379 for details.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
DC CHARACTERISTICS
Driver Differential VOUT
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
Input Current (A, B, A/Y, B/Z)
Y or Z Output Leakage Current
Driver Short-Circuit Current,
VO = High or Low
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
Receiver Output High Voltage
Receiver Output Low Voltage
Test Conditions: VCC = 3.0V to 3.6V; Typicals are at VCC = 3.3V, TA = +25°C. (Note 3)
SYMBOL
TEST CONDITIONS
TEMP MIN
(°C) (Note 13) TYP
VOD RL = 100Ω (RS-422) (Figure 1A), (Note 12)
Full
2
2.3
RL = 54Ω (RS-485) (Figure 1A)
Full
1.5
2.1
No Load
Full
-
-
RL = 60Ω, -7V ≤VCM ≤12V (Figure 1B),
(Note 12)
Full
1.5
2
ΔVOD RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.01
VOC
ΔVOC
RL = 54Ω or 100Ω (Figure 1A)
RL = 54Ω or 100Ω (Figure 1A)
Full
-
2
Full
-
0.02
VIH DI, DE, RE
Full
2
-
VIL DI, DE, RE
Full
-
-
IIN1 DI = DE = RE = 0V or VCC
Full
-2
-
IIN2 DE = 0V, VCC = 0V or VIN = 12V
3.6V
VIN = -7V
Full
-
-
Full
-160
-
IOZ DE = 0V, -7V ≤VY or VZ ≤12V, ISL3180E Only Full
-40
-
IOSD1 DE = VCC, -7V ≤VY or VZ ≤12V (Note 5)
Full
-
-
VTH -7V ≤ VCM ≤ 12V
Full
-200
-
ΔVTH
VOH
VOL
VCM = 0V
IO = -12mA, VID = -50mV
IO = +10mA, VID = -200mV
25
-
28
Full VCC - 0.5 -
Full
-
-
MAX
(Note 13) UNITS
-
V
VCC
V
VCC
-
V
0.2
V
2.5
V
0.2
V
-
V
0.8
V
2
µA
220
µA
-
µA
40
µA
±250
mA
-50
mV
-
mV
-
V
0.4
V
4
FN6365.2
April 22, 2008