ISL12057 Datasheet, PDF (4/17 Pages) Intersil Corporation – Low Cost and Low Power I2C RTC Real Time Clock/Calendar

ISL12057
Absolute Maximum Ratings
Voltage on V_DD (respect to GND) . . . . . . . . . . . . . . . . . . -0.2V to 4V
Voltage on IRQ1/F_OUT, IRQ2, SCL and SDA
(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 6V
Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . -0.2V to 4V
ESD Rating ((Per MIL-STD-883 Method 3014)
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>350V
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W)
8 Lead SOIC (Note 3) . . . . . . . . . . . . . . . . . . . . . . .
120
8 Lead MSOP (Note 3). . . . . . . . . . . . . . . . . . . . . . .
169
8 Lead µTDFN (Note 3) . . . . . . . . . . . . . . . . . . . . . .
160
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
3. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
(Note 6) (Note 5) (Note 6) UNITS NOTES
V_DD
V_DDT
I_DD1
I_DD2
I_DD3
Full Operation Power Supply
Timekeeping Power Supply
Standby Supply Current
V_DD = 3.6V
V_DD = 3.3V
Timekeeping Current
V_DD = 1.8V
Supply Current With I²C Active at Clock
Speed of 400kHz
V_DD = 1.6V
V_DD = 3.6V
1.8
3.6
V
1.4
1.8
V
600
950
nA 4, 10
500
nA
400
650
nA 4, 10
350
nA
15
40
µA
4
I_LI
Input Leakage Current on SCL
I_LO
I/O Leakage Current on SDA
IRQ1/F_OUT and IRQ2
V_OL
Output Low Voltage
V_DD = 1.8V, I_OL = 3mA
-100
-100
100
nA
100
nA
0.4
V
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 6)
TYP
MAX
(Note 5) (Note 6) UNITS NOTES
SERIAL INTERFACE SPECS
V_IL SDA and SCL Input Buffer LOW
Voltage
V_IH SDA and SCL Input Buffer HIGH
Voltage
-0.3
0.7 x V_DD
0.3 x V_DD V
5.5
V
Hysteresis SDA and SCL Input Buffer
Hysteresis
V_PULLUP Maximum Pull-up voltage on
SDA during I²C communication
V_OL SDA Output Buffer LOW Voltage, V_DD > 1.8V, V_PULLUP = 5.0V
Sinking 3mA
0.04 x V_DD
V
V_DD + 2
V
9
0
0.4
V
Cpin
f_SCL
t_IN
SDA and SCL Pin Capacitance
SCL Frequency
T_A = +25°C, f = 1MHz, V_DD = 5V,
V_IN = 0V, V_OUT = 0V
Pulse width Suppression Time at Any pulse narrower than the max spec
SDA and SCL Inputs
is suppressed.
10
pF
7, 8
400
kHz
50
ns
t_AA SCL Falling Edge to SDA Output SCL falling edge crossing 30% of V_DD,
Data Valid
until SDA exits the 30% to 70% of V_DD
window.
900
ns
9
4
FN6755.0
June 15, 2009