ISL6208A Datasheet, PDF (3/10 Pages) Intersil Corporation – High Voltage Synchronous Rectified Buck MOSFET Driver

ISL6208A
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V_FCCM, V_PWM). . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V_BOOT-GND). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT To PHASE Voltage (V_BOOT-PHASE) . . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
GND -8V (<20ns Pulse Width, 10µJ)
UGATE Voltage . . . . . . . . . . . . . . . . V_PHASE - 0.3V (DC) to V_BOOT
V_PHASE - 5V (<20ns Pulse Width, 10µJ) to V_BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 125°C
Thermal Information
Thermal Resistance (Typical Notes 2, 3, 4) θ_JA (°C/W) θ_JC (°C/W)
SOIC Package (Note 2) . . . . . . . . . . . .
110
n/a
QFN Package (Notes 3, 4). . . . . . . . . .
80
15
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-10°C to 100°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Phase Voltage is capable of withstanding -7V DC when the BOOT pin is at GND.
2. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current
POR
I_VCC
PWM pin floating, V_FCCM = 5V
Vcc Rising
-
100
-
µA
-
3.30 3.90
V
Vcc Falling
2.40 2.90
-
V
POR Hysteresis
-
400
-
mV
BOOTSTRAP DIODE
Forward Voltage
PWM INPUT
V_F
V_VCC = 5V, forward bias current = 2mA
0.45 0.60 0.65
V
Input Current
PWM Three-State Rising Threshold
PWM Three-State Falling Threshold
Three-State Shutdown Holdoff Time
UG/LG Three-state Propagation Delay
FCCM INPUT
I_PWM
t_TSSHD
t_PTS
V_PWM = 5V, V_FCCM = 5V
V_PWM = 0V, V_FCCM = 5V
V_VCC = 5V
V_VCC = 5V
V_VCC = 5V, temperature = 25°C
-
250
-
µA
-
-250
-
µA
0.70 1.00 1.30
V
3.5
3.8
4.1
V
-
70
-
ns
-
20
-
ns
FCCM Threshold
-
2.5
-
V
FCCM Transient Delay
SWITCHING TIME
R_SET = 0Ω
-
70
-
ns
UGATE Rise Time (Note 5)
LGATE Rise Time (Note 5)
UGATE Fall Time (Note 5)
t_RU
V_VCC = 5V, 3nF Load
t_RL
V_VCC = 5V, 3nF Load
t_FU
V_VCC = 5V, 3nF Load
-
8.0
-
ns
-
8.0
-
ns
-
8.0
-
ns
3
FN9272.0
February 15, 2006