ISL6208 Datasheet, PDF (3/11 Pages) Intersil Corporation – High Voltage Synchronous Rectified Buck MOSFET Driver

ISL6208
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Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V_FCCM, V_PWM). . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V_BOOT-GND). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT To PHASE Voltage (V_BOOT-PHASE) . . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
GND - 8V (<20ns Pulse Width, 10µJ)
UGATE Voltage . . . . . . . . . . . . . . . . V_PHASE - 0.3V (DC) to V_BOOT
V_PHASE - 5V (<20ns Pulse Width, 10µJ) to V_BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
SOIC Package (Note 2) . . . . . . . . . . . .
110
N/A
QFN Package (Notes 3, 4). . . . . . . . . .
80
15
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-10°C to +100°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Recommended Operating Conditions, Unless Otherwise Noted. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
V_CC SUPPLY CURRENT
Bias Supply Current
POR
I_VCC
PWM pin floating, V_FCCM = 5V
-
80
-
µA
V_CC Rising
V_CC Falling
Hysteresis
-
3.40 3.90
V
2.40 2.90
-
V
-
500
-
mV
BOOTSTRAP DIODE
Forward Voltage
PWM INPUT
V_F
V_VCC = 5V, forward bias current = 2mA
0.50 0.55 0.65
V
Input Current
PWM Three-State Rising Threshold
PWM Three-State Falling Threshold
Three-State Shutdown Hold-off Time
FCCM INPUT
I_PWM
t_TSSHD
V_PWM = 5V
V_PWM = 0V
V_VCC = 5V
V_VCC = 5V
V_VCC = 5V, temperature = +25°C
-
250
-
µA
-
-250
-
µA
0.70 1.00 1.30
V
3.5
3.8
4.1
V
100
175
250
ns
FCCM LOW Threshold
0.50
-
-
V
FCCM HIGH Threshold
-
-
2.0
V
SWITCHING TIME
UGATE Rise Time (Note 5)
t_RU
V_VCC = 5V, 3nF load
-
8.0
-
ns
3
FN9115.3
August 7, 2008