ISL54209 Datasheet, PDF (3/19 Pages) Intersil Corporation – MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown

ISL54209
Pin Descriptions
TDFN
1
2
3
4
5
6
7
8
9
10
PD
µTQFN
2.1mmx1.6mm
1
2
3
4
5
6
7
8
9
10
-
µTQFN
1.8mmx1.4mm
10
1
2
3
4
5
6
7
8
9
-
NAME
VDD
IN
COM-
COM+
GND
R
L
D+
D-
CTRL
PD
FUNCTION
Power Supply
Digital Control Input
Voice and Data Common Pin
Voice and Data Common Pin
Ground Connection
Audio Right Input
Audio Left Input
USB Differential Input
USB Differential Input
Digital Control Input (Audio Enable)
Thermal Pad. Tie to Ground or Float
Ordering Information
PART
NUMBER
PART
TEMP. RANGE
MARKING
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL54209IRUZ-T
(Notes 3, 4, 5)
GF
-40 to +85 10 Ld 2.1mmx1.6mm µTQFN
L10.2.1x1.6A
ISL54209IRU1Z-T
U4
-40 to +85 10 Ld 1.8mmx1.4mm µTQFN
L10.1.8x1.4A
(Notes 3, 4, 5)
ISL54209IRTZ-T
(Notes 2, 4, 5)
4209
-40 to +85 10 Ld 3mmx3mm TDFN
L10.3x3A
ISL54209IRTZ
(Notes 2, 5)
4209
-40 to +85 10 Ld 3mmx3mm TDFN
L10.3x3A
ISL54209EVAL1Z
ISL54209 Eval Kit
NOTES:
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach
materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
4. Please refer to TB347 for details on reel specifications.
5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54209. For more information on MSL please
see techbrief TB363.
3
FN6627.4
June 10, 2010